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A TIM (Thermal Interface Material) joint is an element of every heatsink or waterblock installation, and is also the most variable part of any CPU cooling system. Not always appreciated is that the TIM joint variation can easily exceed the difference between different waterblocks, so its control is essential for comparative testing.
The joint consists of the CPU substrate (surface), the thermal grease or PCM (Phase Change Material) tape, and the heatsink or waterblock substrate; and obviously the clamping mechanism by which the joint is held together.
The CPU substrate is normally used as-is, since any DIY 'treatment' will result in a less flat surface.
Where an IHS (Integral Heat Spreader) is used, some have 'announced' that theirs was concave - and that they sanded it flat - without apparently understanding that IHSs are thin and designed to deflect to a flat position under the recommended clamping force (but who ever heard of a DIYer that did not know more than Intel?).
The heatsink and waterblock substrates are a whole 'nother kettle of fish; however, their inadequacies are well known. Lapping is indeed worthwhile, but it takes the right materials and good technique (my present preference is 15 micron diamond powder on a new Class B granite surface plate, followed by 3 micron on a different plate - but I'm quite into all this, eh).
Some general observations on waterblocks:
ONLY one waterblock manufacturer ships a FLAT waterblock - Swiftech. ALL the rest (that I have seen - many) are crappy. And while the Swiftechs are flat, I have found their finish less than optimum (but if one presumes to improve it, VERY good technique is needed - for most best left as is).
The remaining joint component is the grease or PCM (frag) tape, of which the tape is the far better solution in terms of consistency and long term reliability. The proper application of grease is VERY technique sensitive, and is not the same for all greases.
Without getting into a grease superiority wrangle, I would observe that after very extensive comparative testing, I have concluded that Cooling Flow is superior for my testing purposes due to the reduced variability of the assembled thermal impedance of the TIM joint itself (note that my test setup enables the measurement of such, to 0.01癈).
So, finally, returning to the initial question: How to ensure consistent contact?
Different manufacturers have different solutions to this problem: My preference for the most elegant is the German design with the springs integrated into the 3-lug retaining clip itself, or the LiquidCC 'bullet' spring compression limiters. As I use the 4 mobo mounting holes with springs as a 'universal' mounting method, two aspects must be addressed:
The springs' compression rate , and
The actual compression as installed.
A Load vs. Deflection curve is made for each spring, and 4 selected that are nominally equal. I have found the Swiftech springs to be quite consistent, and a typical graph is shown:
Generated with a Chatillon strain gauge load cell.
Now it is a straightforward exercise to select the amount of compression desired to achieve a specific compressive load across the TIM joint. The springs are tightened incrementally and the final compression is set, and measured, to 0.001 inch - each spring.
N.B. the weight of filled hoses and any other externally applied loads must be identified, and quantified, to control the total clamping force. My solution to this dilemma is to suspend everything and to add the weight of the die assembly and instrumentation cables to the load applied by the springs - takes much 'tweaking' to sort it out.
And that was the good news - the bad news is that some joint induced variability will still remain despite all efforts. Learn how to install a particular waterblock, 5 trials or more, then do it 10 times to understand the range and standard deviation; if OK, make the run - I run 3 times for real tests.
Note that a 'flyer' that is worse can be rationalized, a 'flyer' that is better, however, indicates that the setup has not been optimized - START ALL OVER!
Hope this provides some insights as to ways to reduce the assembly variability. It ain't easy.
Be cool. |
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Aku pakai thermal grease Arctic Silver 3, lilin hitam original P4 kikis basuh abis dgn menggunakan nail polisher(acetone). Skarang dah ada Arctic Silver 5.
mimpi siang hari: Pastu aku amik kertas pasir dan gosok base heatsink sampai berkilat macam cermin. Kerataan base gak dipastikan dgn menggunakan sesiku L rotring made in germany, high precision. Sume utk memastikan haba dari processor dikonduksikan dgn efektif dan menyeluruh, seterusnya memantapkan keseimbangan antara rohani, jasmani, feng shui dan 5 unsur iaitu air, angin, bumi, api dan kayu.
Kebanyakan pengguna komputer tak sedar bahawa kebanyakan komputer crash adalah disebabkan oleh unsur-unsur alam dan spiritual yang tidak seimbang. Ketidakseimbangan ini buleh disebabkan oleh latch kat frame utk pegang heat sink terpatah, cpu fan mati dan lain2. Contohnye kematian fan cpu menyebabkan kekurangan unsur angin. |
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Dulu dulu bolehlah
Masa nie dengan rega computer yang murah dan technologies yang selalu berubah, aku rasa malas nak fikir tentang modding nie lagi.....
Kalau rosak, beli ajer baru hihihihi |
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Nyampuk jap.. berbalik kepada permasalahan Fan berpusing laju dan bising sekali sebelum ini
Aku try tengok apa beza Fan Processor kat PC Office yang senyap giler dengan Fan Processor kat PC rumah..
yang aku tengok bezanya ialah :
Aku punya cop Intel -> Opis punya Cop company AVC Taiwan
Aku punya dia klip kat Motherboard -> Opis punya pakai Skru
Bila aku tanggalkan Opis punya tu.. aku tengok dia ada cecair cream warna putih. macam ubat gigi manakala yanag kat rumah aku takde.
Design sirip berbeza:
yang PC rumah dia jenis straight manakala yang opis punya jenis curve
Material Sirip lain. yang opis punya kasar sikit manakala yang kat rumah cop Intel tu dia licin..
persoalan pertama : mengapakah FAN yang bercop Intel ni terlalu bising? dia tak baguskah? kenapa pulak Fan dari company AVC (nama tak glamer , lebih senyap)
Persoalan kedua : kalau aku nak beli FAN Processor yang baru, berapa harganya? bolehkah kita tukar Sink sahaja? or Fan come with Sink..
Benda yang macam Ubat gigi tu apa? kenapa kat PC rumah aku takde mende tu? tapi PC kat opis ade pulak..? itu ke yang membuat Fan Processor tu berpusing laju?
terima kasih.. |
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1. Fan tu cop intel je tapi bkn intel bwat, Sanyo Denki agaknye. Heatsink AVC Sunflower ke tuh? Power apa? Intel pakai design heatsink tu utk P4 3.06Ghz. Sama cam tadi, AVC bwat heatsink je. Kipas die mungkin low power atau silent model. Ini ada info pasal AVC Sunflower. http://www.dansdata.com/coolercomp_p9.htm#sunflower
2. Heatsink P4 punye fan aku rasa takleh tukar laa. Heatsink lain biasanya pakai 70mm/80mm fan yg standard dan buleh tukar2 utk P4/Athlon. Kalau nak power tu pakai fan 12W Delta.
3. Processor rumah Peace P4 ke? Kalau P4 patot ada lilin hitam. Bende tulah thermal paste utk pengkonduksian haba yg lebih power. Takde kene mengena ngan fan speed. |
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PC kat rumah P4 2.53Ghz.. PC office tu P4 1.7Ghz..
lilin hitam tu apa? cream putih yang kat processor pc office tu apa pulak?
bila peace angkat Fan Processor yang kat rumah tu.. dia takde lah pulak krim... tulisan kat processor tu pun takde.. yang tinggal macam sticker segiempat hangus.. melekat kat heatsink....
yang kat heatsink pc opis tu pulak.. dia punya tanda kat heatsink tu bulat.. kaler oren.. dan dikelilingi krim putih tu lah..
harga heatsiing ngan fan ni berapa selalunya? (yang murah ler.. cam yang PC Office ni pakai)
[ Last edited by peace on 4-7-2004 at 04:17 PM ] |
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Tu bkn sticker, tu lah lilin hitam yg aku maksudkan. Bila P4 tu panas, lilin jadi cair dan menolong mengkonduksikan haba dari P4 dgn lebih baik. Fungsi die sama je macam krim putih tu cuma warna je lain, so no need to worry.
the thermal grease or PCM (Phase Change Material) tape The remaining joint component is the grease or PCM (frag) tape, of which the tape is the far better solution in terms of consistency and long term reliability. The proper application of grease is VERY technique sensitive, and is not the same for all greases.
Inilah krim putih dan lilin yg dimaksudkan. |
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tapi bila aku dah angkat Fan tu.. nak kena replace lilin hitam yang baru (cam gasket motor tu) atau letak balik jek? |
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Yg kaler oren kat heatsink ofis tuh logam copper. Copper konduksi haba lagi power dari aluminium yg kat keliling nye(warna putih) sbb tu die kat tgh2 supaya contact ngan processor.
Heatsink PC office tu brape harganye? Heatsink tu mmg high end dan utk processor yg power atau dioverclock. Eokboy tatau kenapa heatsink tu ditarok atas 1.7Ghz cpu. Heatsink yg biasa utk P4 rm50 camtulah.
malas nak kasi kredit satu satu :lol
[ Last edited by Sarah_Radzi on 4-7-2004 at 12:17 PM ] |
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Originally posted by peace at 4-7-2004 04:28 PM:
tapi bila aku dah angkat Fan tu.. nak kena replace lilin hitam yang baru (cam gasket motor tu) atau letak balik jek?
Tak payah, tarok balik je. |
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yang krin tu camne lak? aku siap lap - lap lagi.. tinggal balance krim kat processor je.. camne? hangus tak processor pc opis tu nanti? |
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Originally posted by Eokboy at 4-7-2004 16:30:
Yg kaler oren kat heatsink ofis tuh logam copper. Copper konduksi haba lagi power dari aluminium yg kat keliling nye(warna putih) sbb tu die kat tgh2 supaya contact ngan processor.
Heatsink PC office tu brape harganye? Heatsink tu mmg high end dan utk processor yg power atau dioverclock. Eokboy tatau kenapa heatsink tu ditarok atas 1.7Ghz cpu. Heatsink yg biasa utk P4 rm50 camtulah.
sebab tu pc kat office tu lagi senyap agaknya.. pc opis tu Brand Compaq..
aku punya lah dia punya temperature masa baru bukak.. 61, M/b 42
CPU Fan speed - 4047 RPM. . tu lah yang rasa bising tu kot..
Heatsink yang RM 50 tu yang cam heatsink office ni lah ye? |
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Heh heatsink tu dah terlebih power takyah krim langsung pon buleh. |
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ic... thank you boy...:bgrin: |
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posting di atas dapat kredit sbb banyak soalan bijak :bgrin: |
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Antara ciri HSF (heat sink fan) senyap
+ Konduktor emas/ tembaga (-copper base)
+ Kipas besar + ball bearing
+ Kelajuan kipas rendah 3000-4000RPM
+ Kekuatan daya angin (Cfm)
harga ?
RM 120,
Contoh ?
Thermaltake 12+ Silent,
Coolermaster Aeroflow, Silent |
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Originally posted by H猷L鰃頧 at 5-7-2004 14:54:
Antara ciri HSF (heat sink fan) senyap
+ Konduktor emas/ tembaga (-copper base)
+ Kipas besar + ball bearing
+ Kelajuan kipas rendah 3000-4000RPM
+ Kekuatan daya angin (Cfm)
harga ?
RM 120,
Contoh ?
Thermaltake 12+ Silent,
Coolermaster Aeroflow, Silent
Terima kasih..:bgrin: ni gerenti ke? nanti aku pegi carik..
Fan Casing lak braper?(yang senyap gak) aku takde Fan Casing ler.. |
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Kalau tak main game atau overclock takyah case fan, cukup fan kat psu je. |
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Originally posted by H猷L鰃頧 at 5-7-2004 02:54 PM:
Antara ciri HSF (heat sink fan) senyap
+ Konduktor emas/ tembaga (-copper base)
+ Kipas besar + ball bearing
+ Kelajuan kipas rendah 3000-4000RPM
+ Kekuatan daya angin (Cfm)
harga ?
RM 1 ...
Kalau nak bebetol senyap beli h/s zalman yg tadek fan. Tapi casing ventilation kene baik. |
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Post time 2-7-2004 03:40 PM
变色卡
